导热相变材料的作用

Thermally Conducting Phase Change Materials (PC) are heat-enhanced polymers designed to minimize the thermal resistance between power consuming electronics and the heat sink attached to them. This small thermal resistance causes the heat sink's performance Achieve the best, and improve the reliability of the microprocessor, memory module DC / DC converter and power module.

The key property of a thermally conductive phase change material is its phase change behavior: The material is solid at room temperature and easy to handle, and can be used as a dry pad to clean and sturdy for heat sinks or device surfaces. When the operating temperature of the device is reached, the phase change material becomes softer and with a little extra tightening force, the material is as easy to integrate with the two mating surfaces as hot grease. This ability to completely fill the interfacial air gap and the space between the device and the heatsink renders the phase change pad superior to non-flow elastomer or graphite-based thermal pads and achieves performance similar to thermal grease.

The thermally conductive phase-change material is non-conductive, but because the material undergoes phase change during typical heat sink installation, it is possible for the metal to be in contact with the metal so that the phase-change material can not be used as electrical insulation. A small thermal resistance phase change interface pad is not a structural adhesive, can not directly connect the heat sink to the device, you must use clips or other mechanical fasteners to maintain the heat sink to the device clamping pressure.