Non silicon thermal conductive gel

Non silicon thermal conductive gel is a kind of stress free, ultra-low thermal resistance, paste like thermal conductive material with a shape similar to that of plasticine. Its outer packaging is needle tube packaging, which does not require refrigeration, mixing, and curing. It has been proven to have long-term reliability and excellent thermal conductivity.

Detailed description

● GPU-500SF is a silicon free thermal conductive putty with high performance thermal conductive compound. It is a fully cured thermal management solution for electronic components.

● It has low viscosity and is suitable for dispensing applications; The material has good adhesion to the heat sink and can be used in applications involving automatic dispensing equipment or stencil screen printing.

● It is an ideal choice for rework and field maintenance. Compared with the heat conduction pad, the material can completely fill the blank, has good compressibility and saves costs.

● GPU-300SF complies with RoHS standards and contains no halogen, providing additional assurance in applications where the use of hazardous substances is prohibited.

Features and advantages: thermal conductivity 5.0 W/m-K; Non silica gel; Non curing; Natural viscosity&low contact resistance; Good compressibility; Good electrical insulation

Application: heat source of radiator/sink; Computer and peripheral equipment radiator; Memory module; Power conversion equipment; Components cooled to the chassis; Type of radiator; Wireless communication hardware; Telecommunication services; Automobile control device.