Product
- Adhesive
- Silicone adhesive
- Polyurethane Adhesive
- Epoxy adhesive
- Potting adhesive
- Silicone encapsulant
- Epoxy potting adhesive
- Heat conduction and heat dissipation materials
- Thermal conductive silicone grease
- Thermal conductive silicone gasket
- Heat conductive double-sided adhesive
- Silicone tape
- Thermal conductive gel
- Heat conducting mud
- Phase change material
- Coating adhesive
- MS glue
- Hot melt adhesive
- Anaerobic
- Acrylic structural adhesive
Epoxy potting adhesive
Details
Potting adhesive addition molding is a low viscosity flame-retardant two-component silicone potting adhesive, which can be cured at room temperature or by heating. The higher the temperature is, the faster the curing speed is, and the higher the thermal conductivity is; Condensed potting adhesive can only be cured at room temperature and has good adhesion with the substrate.
