Thermal conduction design

As a special subject, thermal design successfully solves the problem of heat loss or retention in equipment. In thermal design, it is often necessary to consider the heat conduction between power devices and heat sinks. The reasonable selection of heat transfer medium should not only consider its heat transfer capacity, but also take into account the production process, maintenance operability, and excellent cost performance.

These materials are designed for the heat conduction requirements of equipment in recent years, with excellent and reliable performance. They are suitable for various environments and requirements. They have appropriate countermeasures for possible heat conduction problems, and provide a powerful help for the high integration of equipment, as well as ultra small and ultra-thin. This heat conduction product has been increasingly used in many products, improving the reliability of the product.

(1) Phase change thermal conductive insulating material

By taking advantage of the characteristics of the substrate, the phase change occurs at the working temperature, which makes the material more closely fit to the contact surface, and at the same time, the ultra-low thermal resistance is obtained, which makes the heat transfer more thorough. It is a reliable choice for CPU, module power supply and other important devices.

(2) Thermal conductive gasket

The crystallization of special process and advanced technology, extraordinary thermal conductivity and low resistance are materials used in special occasions. Their thermal conductivity and flexibility of the material itself well meet the heat dissipation and installation requirements of power devices.

(3) Heat conduction tape

It is widely used in the bonding between power devices and radiators. It can realize the functions of heat conduction, insulation and fixation at the same time, effectively reduce the volume of equipment, and is a favorable choice to reduce the cost of equipment.

(4) Thermal insulation elastic rubber

It has good thermal conductivity and high pressure resistance, which meets the current demand of the electronic industry for thermal conductivity materials. It is a binary powder that replaces silicone grease thermal conductive paste and mica chips

The best product of thermal system. This kind of product is easy to install, which is conducive to automatic production and product maintenance. It is a new type of material with great technology and practicality.

(5) Flexible heat conduction pad

A kind of thick heat conduction liner, specially produced for the design scheme of using gaps to transfer heat, can fill gaps and complete the heat of heating and cooling parts

At the same time, it can also play the role of shock absorption, insulation, sealing, etc., which can meet the design requirements of miniaturization and ultra-thin equipment.

(6) Heat conductive filler

It can also be used as heat conduction adhesive, which not only has the effect of heat conduction, but also is a good material for bonding, sealing and sealing. By filling the contact surface or pot,

Conducting heat from heating components.

(7) Heat conductive insulation potting adhesive

Heat conductive insulation potting adhesive is suitable for potting electronic components with high heat dissipation requirements. The cured adhesive has good thermal conductivity, excellent insulation and excellent electrical performance,

Good adhesion and surface gloss.