Use method of heat conductive double back adhesive tape

Attention shall be paid to the operation method during the bonding of the thermal conductive double back adhesive tape. It is strictly forbidden to touch the surface with hands or other non adhesive materials. It is strictly prohibited to repeatedly peel and paste. The bonded surface shall be kept clean and dry. Generally, it shall be cleaned with alcohol before use to avoid affecting the bonding fastness. Auxiliary supplies: cotton cloth, industrial cleaner, rubber gloves.

Step 1: Wipe the device surface with lint free cotton cloth.

Step 2: Wipe the surface of the device with a cotton cloth soaked in industrial cleaner to remove oil stains; In addition, do not touch the clean surface during installation.

Step 3: Tear off the protective film on one side of the adhesive, and keep your fingers away from the adhesive.

Step 4: Paste it on the surface of the device, and gently press it from the center of the bonding area to the periphery for five seconds to ensure that the double back adhesive tape is 100% in contact with the surface of the heat sink.

Step 5: Tear off the protective film on the other side of the adhesive tape, and follow the same method in step 3 and step 4 to make the adhesive bond between the double back adhesive tape and the chip firm.