Flexible heat conduction pad

Flexible heat conduction pad is a kind of thick heat conduction pad. At present, the base materials used are basically silicone rubber and foaming rubber. Silicone rubber is characterized by good elasticity and foaming rubber is characterized by large deformation range, good heat conduction effect and higher pressure resistance. Flexible heat conduction pads are often used as fillers for large gaps to transfer heat. They are usually used between PCBs, between PCBs and casings, between power devices and casings, or just pasted on chips as heat sinks (corrugated ones are generally used in this case). The heat conduction filling particles in the flexible heat conduction pad are generally aluminum oxide particles or a mixture of aluminum oxide, magnesium oxide and boron nitride particles, which have good heat conduction performance and can prevent puncture, and really play an insulating role.

Application: heat pipe assembly, RDROMTM memory module, CDROM cooling, between CPU and heat sink, any occasion where heat needs to be transferred to the shell, chassis or other heat sinks

usage method:

Prepare auxiliary supplies: cotton cloth, industrial cleaner, rubber gloves.

Step 1: Wipe the device surface with lint free cotton cloth.

Step 2: Wipe the surface of the device with a cotton cloth soaked in industrial cleaner to remove oil stains.

Step 3: Tear off the protective film on one side of the adhesive, and keep your fingers away from the adhesive.

Step 4: gently press the flexible heat conduction pad to ensure firm bonding.

Product specification:

T274 is 9 inches by 9 inches (228.6mmX228.6mm)

The specification of GP-1500 and GP-A3000 is 8 "x16" (203mmX406mm)