Gutai thermal conductive patch production device has obtained patent authorization

Recently, the State Intellectual Property Office granted Shenzhen Gutai Technology Co., Ltd. a patent right CN 202147344 U "Organic Silicon Thermal Conductive Patch Molding Machine". The patent right protects a molding machine for thermal conductive silicon film. With this molding machine and its production line, the automatic and continuous production of thermal conductive silicone film can be realized. This is a change from the way that most domestic enterprises used to use molding intermittent production, Greatly improve the production efficiency and product quality. Thermal conductive silicon film, as the most widely used thermal conductive interface material, is used in LED lighting, power modules, integrated chips, power modules, automotive electronics, communications, computers, medical equipment and many other fields. It is calculated that the failure rate of the electronic circuit will increase 5-6 times with the increase of 25 ℃ when the operating temperature is above the reference temperature (100 ℃). When the electronic device operates at 70-80 ℃, the reliability of the device will decrease by 5% with the increase of 1 ℃ when the operating temperature is between 70-80 ℃. Therefore, thermal conductive interface materials will have great potential in improving the reliability of electronic devices. The series of thermal conductive interface materials independently developed by Gutai Company include thermal conductive silica gel sheet, silicon tape, thermal conductive phase change material, thermal conductive silicone grease, thermal conductive encapsulating silica gel and thermal conductive bonding silica gel, etc., and have applied for several patents on related technologies.