Introduction of led packaging technology

1. Expanding crystal: the densely arranged wafers are opened a little to facilitate crystal solidification.

2. Solidify crystal, put conductive/non-conductive glue on the bottom of the support (whether conductive or not depends on whether the chip is an up and down PN junction or a left and right PN junction), and then put the chip into the support.

3. Short baking, so that the chip will not move when the glue solidifies the welding line.

4. Solder wire, and use gold wire to conduct the wafer and bracket.

5. Pre test, preliminary test whether it can light up.

6. Inject glue and wrap the chip and bracket with glue.

7. Bake for a long time and let the glue solidify.

8. Post test, test whether it can be lit and whether the electrical parameters meet the standard.

9. Light and color separation, to separate products with roughly the same color and voltage.

10. Packaging.