Ten major technology trends

Ten major technology trends

1. Medium power becomes the mainstream packaging method. At present, most of the products on the market are high-power LED products or low-power LED products. Although they have their own advantages, they also have insurmountable defects. And the medium power LED products that combine the advantages of both have emerged as the times require and become the mainstream packaging method.

2. Application of new materials in packaging. Due to higher and better environmental resistance such as high temperature resistance, UV resistance and low water absorption, thermosetting materials such as EMC, thermoplastic PCT, modified PPA and ceramic like plastics will be widely used.

3. Chip super current density applications. In the future, the chip's super current density will grow from 350MA/mm2 to 700MA/mm2, or even higher. The chip demand voltage will be lower, the VI curve will be smoother (low heat), and both ESD and VF will be considered.

4. The popularization of COB application. With the advantages of low thermal resistance, good light type, no welding and low cost, COM applications will be widely used in the future.

5. The demand for higher light quality.

6. International and domestic standards were further improved.

7. The integrated packaged optical engine has become a packaging value.

8. To power supply scheme (high voltage LED). In the future, indoor lighting will pay more attention to quality. Driven by cost factors, the power removal scheme will gradually become an acceptable product. High voltage LED fully caters to the power removal scheme, but its chip reliability needs to be strengthened.

9. Multi color LED light source for scene lighting. Scene lighting will be the core competitiveness of LED lighting, and the second takeoff of LED lighting in the future will depend on scene lighting.

10. The demand for light efficiency is relatively reduced, and the cost performance ratio has become a magic weapon for packaging plants to win.