Ten major technology trends

Due to the complex structure and process of high-power LED packaging, it directly affects the performance and life of LED, especially the high-power white LED packaging is a hot research topic. The functions of LED packaging mainly include: 1. mechanical protection to improve reliability; 2. Strengthen heat dissipation to reduce chip junction temperature and improve LED performance; 3. Optical control to improve the light output efficiency and optimize the beam distribution; 4. Power supply management, including AC/DC conversion, power control, etc.

The choice of LED packaging method, material, structure and process is mainly determined by chip structure, photoelectric/mechanical characteristics, specific application and cost. After more than 40 years of development, LED packaging has experienced the development stages of lamp LED, SMD LED and power LED. With the increase of chip power, especially the development of solid-state lighting technology, new and higher requirements are put forward for the optical, thermal, electrical and mechanical structures of LED packaging. In order to effectively reduce the thermal resistance of the package and improve the light output efficiency, a new technical idea must be adopted for the package design.