Four Future Mainstream Technologies of LED Packaging and Their Future Development Trends

With the acceleration of LED lighting and other terminal applications, the LED packaging market is also growing. However, increasing revenue without increasing profits is still an unavoidable curse for packaging enterprises. During the exhibition, we carefully observed the products displayed in the exhibition hall of chip packaging brands, understood the current status of the packaging field, and understood the development trend and changes in the competition pattern of the LED packaging industry in the future through communication with enterprises.

The above three feet are for different applications. COB is mainly used for downlights of commercial lighting; CSP is mainly used for high power lighting fixtures with high illumination requirements such as street lamps and High bay; SMD is also a mass market, such as bulb, lamp tube and other large share of civil light source products. "

In addition to the above three mainstream packaging trends, integrated packaged optical modules will also become the focus of enterprise development. EMIC Optical represents that small modules, integrated packaged optical modules or optical engines are one of the development directions of the company, "In fact, the future development trend of the enterprise is that both sides of the chip and the application end should be involved, integrating packaging and heat dissipation, substrate and drive, giving full play to the advantages of LED, and bringing great convenience to downstream lamp customers. I believe that the overall solution provided by the packaging company is exactly what the lamp customer group wants."

At the technical level, the current LED packaging is more focused on chip structure, packaging materials and other aspects to improve the light efficiency. Osram Wussen said at a meeting that there is a general trend in LED packaging materials and packaging forms on the market, and small and medium power products will be packaged with PPA or PCT; EMC packaging has been widely used for medium and high power products, which is also a popular technology in the past two years. In the future, the possibility of EMC packaging more than 20W integrated chips will not be ruled out; In addition to the traditional ceramic packaging of high-power LED, and COB packaging which has developed rapidly in recent years, this basically constitutes the mainstream packaging mode of LED in the lighting market.

How will the pattern of packaging enterprises change?

As for the future packaging industry pattern, Evergrande is the largest, and the degree of industrial concentration has become an enterprise consensus. In the process of leading to the final formation of the industry's competitive pattern, the enterprise is exhausted.

At present, several major international lighting manufacturers guide the entire final consumer market, and there may not be much change in the future. The price war is coming to an end. It is estimated that many packaging enterprises will face a great crisis in the next 10 years and need continuous innovation.

——Seoul Semiconductor

The packaging industry will stabilize in the next three years or so, the vicious competition will be weakened, and the enterprises without core competitiveness will withdraw from the market early.

——Ruifeng Optoelectronics

The development track of LED lighting is basically the same as that of the mainstream semiconductor industry. In the end, it is a standardized product. At this stage, there may be only a few mainstream enterprises in the market, and the industry concentration is deepened.

——Hongli Optoelectronics

At present, there are more than 2000 LED packaging enterprises in China, and the packaging market will also maintain stable growth in 2015. The industry competition is becoming more and more fierce, and the gross profit rate trend is downward as a whole, especially in the lighting LED field, but the total amount is rising, and the profitability in 2015 is optimistic.

——100 million light lighting

Facing the future market competition pattern, I think it should be divided into three steps: first, scale up, expand production through mergers and acquisitions, or improve the supply chain; Second, internationalization, establishing and maintaining its own brand, and stepping onto the international platform; Third, patenting, developing some technical highlights, constantly applying for core patents, or conducting strategic cooperation with international celebrities, so that patent litigation can be attacked and prevented in the future.

——Yimei Core Light